UCMDA Thermal Compound Paste For Coolers [2g x 5 PCS], HY810 CPU Thermal Paste, [High Stability] Cooling Silicone Heatsink Paste - Thermal conductivity 4.63W/m-k
Description
High performance cooling
Polymer oxides can efficiently transfer heat between CPU, GPU and heat sink.Used for high power CPU and GPU cooling.
Easy to apply
Needle tube design for easy installation and cleaning.
Safety
The thermal compound paste has battery insulation and corrosion resistance, avoids safety hazards caused by products, and achieves an effective combination of safety and thermal conductivity.
thermal conductivity:>4.63W/m-k
thermal resistance:<0.0087℃-in²/W
Instant temperature resistance: -50-300℃
Working temperature: -30-280℃
Concentration: 280±10 1/10mm
Install Tips:
1: From the inside out, spread evenly on the surface, no bubbles.
2: Thermal Compound Paste can not be coated too thick, which will affect heat conduction.
Package include:
5 × 2G HY810 Thermal Grease
5×Scraper
5×Grease Cleanser